Eastern Display COG LCD modules are growing rapidly 

COG (Chip-on-Glass) LCD module LCM is a display technology that directly binds the driver chip (IC) on the glass substrate. It is widely used in small-sized and highly integrated electronic devices.

1. Structure and working principle

structural composition ：

-LCD panel: based on glass substrate, containing liquid crystal layer and transparent electrode (ITO).

-Drive IC: Directly fixed to the edge of the glass by anisotropic conductive adhesive (ACF).

-Peripheral circuits: including power supply, signal interface, etc., which are usually connected through flexible circuit board (FPC).

operational principle ：

The driver IC controls the deflection of liquid crystal molecules through the electrodes on the glass substrate to adjust the light transmittance and realize the image display.

2. Main features

-Light weight: eliminates the traditional PCB carrier, the thickness can be less than 1mm, suitable for small equipment.

-High integration: driver IC and glass integrated design, reducing the number of peripheral components.

-Low power consumption: simplified circuit, reduced energy consumption, suitable for battery powered equipment.

-High reliability: reduces the risk of poor contact by reducing solder joints and connectors.

-Cost advantage: the process is mature for mass production.

3. Typical application scenarios

-Consumer electronics: smartwatches, calculators, portable instruments.

-Industrial equipment: industrial control instruments, handheld terminals.

-Medical equipment: portable monitor, blood glucose meter.

-Automotive electronics: on-board dashboard, central control auxiliary screen.

4. Comparison of advantages and disadvantages

merit

-Small size and light weight, suitable for miniaturized design.

-High circuit stability, strong anti-vibration performance.

-Low power consumption extends battery life.

shortcoming

-Difficult to repair: the driver IC is damaged and the whole module needs to be replaced.

-LCD screen design complexity: high precision binding process is required, and the initial development cost is high.

5. Key technical parameters

-Resolution: Common 128×64,160×160, etc., suitable for small screen size.

-Interface: SPI, I²C and other low pin number protocol.

-Working temperature: wide temperature is usually-20℃~70℃, super wide temperature can reach-40℃~80℃.

-Power consumption: microampere level standby current, milliamper level working current.

EASTERN DISPLAY has an advanced COG module production line, product types include VA/TN/HTN/STN/FSTN,

The highlights of its COG module technology include:

-High precision bonding process: the minimum bonding spacing is up to 15μm, supporting higher density IC integration.

-Customized development: Provide a full process solution from glass cutting, IC selection to driver optimization.

-High reliability: suitable for consumer, industrial and automotive electronics.

EASTERN DISPLAY continues to introduce a variety of COG modules, including customized COG segment code modules, general 128×64,160×160,240×160,320×240 dot matrix COG modules, integrated touch button COG modules, ultra-low power consumption COG modules, and ultra-wide temperature COG modules to meet the needs of different users.