2025-07-31
I-COG (CHIP-ON-GLASS) LCD module LCM ubuchwepheshe bokubonisa obubopha ngqo i-chip (ic) kwi-substrate yengilazi. Isetshenziswa kabanzi kumadivayisi kagesi ahlanganiswe kakhulu futhi ahlanganiswe kakhulu.
Ukwakheka okuhlelekile:
Iphaneli ye -LCD: Kususelwa ku-glass substrate, equkethe ungqimba lwe-crystal ungqimba kanye ne-eflectrote esobala (ITO).
-Dive IC: ilungiselelwe ngqo emaphethelweni engilazi nge-Anisotropic Prial Adhesive (ACF).
-Izingcebo ezikhohlisayo: kufaka phakathi ukuhlinzekwa kwamandla, isikhombimsebenzisi sesiginali, njll., Okuvame ukuxhunywa ngebhodi yokujikeleza okuguqukayo (FPC).
Isimiso sokusebenza:
I-IC yomshayeli ilawula ukwehla kwama-molecule e-liquid crystal nge-electrodes kwi-electrodes engxenyeni engaphansi yengilazi ukuze alungise ukudluliselwa kokukhanya futhi aqaphele isibonisi sesithombe.
Isisindo -Kight: Isusa umthwali we-PCB wendabuko, ubukhulu bungaba ngaphansi kwe-1mm, efanelekile imishini emincane.
Ukuhlanganiswa -High: Umshayeli we-IC kanye ne-Glass ehlanganisiwe design, ukunciphisa inani lezakhi ze-peripheral.
-Kusetshenziswa amandla kagesi: Isifunda esilula, ukusetshenziswa kwamandla okuncishisiwe, kufaneleke ngemishini enamandla yebhethri.
Ukwethembeka -High: kunciphisa ubungozi bokuthintwa kabi ngokunciphisa amalunga nezixhumi.
-Cost inzuzo: Inqubo ivuthiwe ukukhiqizwa kwesisindo.
-Consumer Electronics: SmartWatches, ama-Calculator, amathuluzi aphathekayo.
Amathuluzi ezimboni: Amathuluzi okulawula izimboni, ama-terminals aphethwe ngesandla.
Izinto ezisetshenziswayo: Ukuqapha okuphathekayo, imitha yeglucose yegazi.
-Automotive elekthronikhi: Ideshibhodi yeBhodi, isikrini esiphakathi nendawo sokulawula.
ukufaneleleka
Usayizi we -SMall nesisindo esikhanyayo, esilungele ukwakheka okuncane.
Ukuqina kwesekethe, ukusebenza okunamandla kokuphindwa.
-Ukusebenzisa amandla kagesi kunwebisa impilo yebhethri.
ukushiyeka
-Ukulungisa ukulungiswa okungcolile: I-IC yomshayeli ilimele futhi yonke imodyuli idinga ukushintshwa.
I--LCD Screen Design ChainCy: Inqubo ephezulu yokubopha iyadingeka, futhi izindleko zokuthuthuka kokuqala ziphezulu.
-Resulution: Okuvamile 128 × 64,160 × 160, njll., Ilungele usayizi omncane wesikrini.
-Interface: SPI, i-I²C kanye nezinye izinombolo zephinithi eziphansi.
Ukushisa kokushisa: Ukushisa okubanzi kuvame - 20 ℃ ~ 70 ℃ ℃, ukushisa okuphezulu kakhulu kungafinyelela-40 ℃ ~ 80 ℃.
Ukusetshenziswa -Phono: I-MicroAmpere level level standby yamanje, izinga lama-milliampep asebenza njengamanje.
Ukuboniswa kwe-Eastern kunomugqa wokukhiqiza we-cog advanced, izinhlobo zomkhiqizo zifaka i-VA / TN / HTN / STN / FSTN,
Amaphuzu avelele e-COG Module Consthalogion afaka:
Inqubo yokuhlanganisa i-Heigh Precision Precision: Ukuhlukaniswa okuphansi kobuncane kufika ku-15μm, kusekela ukuhlanganiswa okuphezulu kwe-IC ukuhlanganiswa.
Intuthuko esetshenzisiwe: Nikeza isixazululo senqubo ephelele kusuka ekusikeni kwengilazi, ukukhetha kwe-IC ekusebenzeni komshayeli.
Ukwethembeka -High: Ilungele abathengi, izimboni kanye nezimoto ngogesi.
Ukuboniswa kwe-Eastern kuyaqhubeka ukwethula amamojuli ahlukahlukene we-COG, kufaka phakathi amamojula we-Cog Segment Moderes, okujwayelekile 128 × 160 × 160,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240,320 × 240